{First_Name},

You are invited to apply for subsidized access to the following Microsystems integration enabling technologies.

• 3-D stacking
• Flip-chip attachment
• Encapsulation
• Hermetic sealing and selective encapsulation
• Standard (14-pin butterfly) photonic packaging
• Vacuum packaging
• Integrating a pixel-based camera system or an energy-based optical detection system into your project

- Apply before Monday June 29, 2009 -

This peer-reviewed competition is intended for faculty and graduate students at a university in Canada who:

• Are registered clients of CMC
• Intend to develop a working proof-of-concept prototype within 9 months.
• Are developing microsystems prototypes that integrate multiple technologies for applications in biomedical, environmental, or telecommunications.